Latest Technologies of Epoxy Molding Compound (EMC) for FOWLP
Abstract. FOWLP is used for RF etc. for mobile as a package excellent in low profile, low warpage, cost reduction, electric performance etc. and this market is expanding since it began to be used in Application processer (AP) in 2016. It is expected that adoption to AP for mobile will continue to grow and further expansion to other products is also, Epoxy molding compound ...